Expertise

Aware that planning is a concept of fundamental importance for a company, Nortech Elettronica has invested part of its resources to have an in-house Team of highly qualified people for the Company Management System.

The Quality Assurance Team periodically monitors and evaluates the risk elements that could generate deviations from what was initially set and implements verification, review and continuous improvement actions to keep every single company process under control.

Another fundamental point is the concept of condescension: Each customer has its own specific request that Nortech Elettronica strives to satisfy from time to time, which is why the company succeeds in maintaining excellent and lasting relationships with its customers.

Therefore, Nortech Elettronica’s Corporate Management System, in order to guarantee a high quality product in all respects, frequently re-examines what the company’s objectives are and what the customer’s needs are, which change with technological advancement. It is therefore committed to keeping its organisation chart up-to-date in order to ensure the necessary skills and technical knowledge, thus stimulating the ‘curiosity’ of its employees so that they can face ever-increasing challenges in line with market demands.

Nortech Elettronica works in accordance with the requirements where applicable of ISO 9001:2015 and ISO-TS 22163:2017.

In cooperation with its main customers, it has implemented the following standards:

IPC/EIA J-STD-001 (Requirements for Soldered Electrical and Electronic Assemblies)
IPC/JEDEC J-STD-020 (Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices)
IPC/JEDEC J-STD-033 (Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices)
IPC-A-610 (Acceptability of Electronic Assemblies)
IPC-A-600 (Acceptability of Printed Boards)
IPC-7095 (Design and Assembly Process Implementation for BGAs)

IPC-1601 (Printed Board Handling and Storage Guidelines)
IPC-7711/7721 (Rework, Modification and Repair of Electronic Assemblies)
DIRETTIVA 2011/65/UE (Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment)
CEI EN 61340-5-1/5-2 (Protection of Electronic Devices against Electrostatic Phenomena, General Requirements and Guide to Use)
JESD625-A (Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices)

IPC-7525 (Stencil Design Guidelines)
IPC-7527 (Requirements for Solder Paste Printing)
IPC-9502 (PWB Assembly Soldering Process Guideline for Electronic Components)
IPC-7530 (Guidelines for Temperature Profiling for Mass Soldering Processes -Reflow & Wave)
IPC-HDBK-830 (Guidelines for Design, Selection and Application of Conformal Coatings)
IPC-CH-65 (Guidelines for Cleaning of Printed Boards and Assemblies)
IPC-7093 (Design and Assembly Process Implementation for Bottom Termination SMT Components)

DIRECTIVE 2017/821/EU (Regulation for Conflict Minerals Criteria)

D.lgs. 9 aprile 2008 (Testo unico sulla salute e sicurezza sul lavoro)
IPC-J-STD-003 (Solderability tests for printed boards)
IPC-CH-65B (Guidelines for cleaning printed circuit boards and assemblies)

In order to keep staff up-to-date with the applicable mandatory standards, training courses for IPC Specialists were completed on IPC-A-610, IPC-A-600 and IPC-7711/ 7721.

In the process of implementation:

IPC-1782 (Standard for manufacturing and supply chain traceability of electronic products)
IPC-4101 (Specifications for base materials for rigid and multilayer printed boards)
IPC-4761 (Design guide for the protection of printed circuit board passage structures)
IPC J-STD-609B (Marking, symbols and labels of finished materials for leaded and unleaded terminals used in electronic assembly)